以價值溪流圖分析探討半導體封裝測試製程之精實生產與改善

A Value Stream Mapping Approach to Study Lean Production and Improvement Analysis for the Semiconductor Package and Test Process

莊寶鵰、蕭彤紜
P. T. Chuang and T. Y. Hsiao

國立高雄大學 亞太工商管理學系碩士班


摘要

精實生產之目的在於使其生產線暢流,最終為客戶創造價值,使企業增加利潤。本文應用價值溪流圖為架構,並導入精實生產分析與改善,運用去除浪費的方法來提升整體效率及價值,並致力於工廠設備各項損失的最小化和效率水平的最大化,達到設備完善的極致。針對本研究案例之半導體產業的製程進行研究與討論,將生產流程繪製成價值溪流圖,從顧客的需求回溯到原材料,來分析整個「生產流程」,並導入拉式生產概念,改善現有模式,減少不必要的浪費,有效提升企業競爭力,使企業永續經營。採用精實管理的價值流分析可以協助製程人員更了解整個材料及資訊的流動,並以未來狀態圖做為溝通及引導改善計畫之進行,最後將未來價值溪流圖及改善方案提供給公司主管與現場作業人員作為改善之參考。

關鍵字:精實生產、價值溪流圖、半導體封裝測試。

ABSTRACT

This research case is based on the process of semiconductor industry to conduct research and discussion, it’s based on the value stream map and introduces Lean Production to analyze and improve. The production process is drawn into a value stream map to improve existing models and reduce unnecessary waste, to enable enterprises to effectively enhance their competitiveness.

Value stream can help process engineer to further understand the flow of materials and information, using future-stage map as a guide to improvement. The goal of this study is to provide the future-stage map and improvement solutions to company supervisors and operators as a basis for improvement.

Keywords: Lean Production; Value Stream Mapping; Semiconductor Industry